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作 者:陈治洲 曹开钦 缪斌[1] 柴孟阳[1] 刘书锋[1] 孙德新[1,2] 刘银年
机构地区:[1]中国科学院红外探测与成像技术重点实验室中国科学院上海技术物理研究所,上海200083 [2]中国科学院大学,北京100049
出 处:《红外技术》2017年第10期880-883,共4页Infrared Technology
基 金:国家高分辨率对地观测系统重大专项(A0106/1112);国家863计划(2014AA123202);国家重点研发计划(2016YFB0500401)
摘 要:针对某空间高光谱相机电控箱内同时存在高功率器件和经筛选后温度鲁棒性较低的工业级芯片的情况,对电控箱进行合理的热设计。除了对箱体进行表面发黑、填充导热材料外,对电控箱内各个单板设计了"日"字型金属导热框架,在敏感芯片顶部增加了导热铜片。为验证散热设计方案的合理性,对电控箱基于Icepak软件进行了建模分析,仿真结果显示最高温度为75.6℃,小于85℃,散热方案满足指标要求。最后对电控箱进行热真空试验,试验结果与仿真结果一致,热控设计合理。Electric cabinets of space hyperspectral cameras contain high power electric components as well as industrial grade chips that can withstand low temperature. This makes it imperative to develop an appropriate thermal design for such cabinets. In addition to surface black oxidation and filling of the cabinet using materials of high thermal conductivity, we have designed "日"-shaped metal frameworks with high thermal conductivity for each printed circuit board in the cabinet, and added copper sheets on top of the sensitive chips. Modeling was performed using Icepak to evaluate the effectiveness of the thermal design scheme. The simulation results reveal a maximum temperature of 75.6℃, which is less than 85℃. This indicates that our thermal scheme satisfies the requirements of the indicator. In addition, we have performed thermal vacuum tests of the electric cabinet. The experimental results are in good agreement with the simulation results, thereby validating the effectiveness of our thermal design.
分 类 号:TN216[电子电信—物理电子学]
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