采用纳米银焊膏烧结互连技术的中高压IGBT模块及其性能表征  

Medium and High Voltage IGBT Module Using Nanosilver Paste Sintering Technology and Its Performance Characterization

作　　者：梅云辉[1,2] 冯晶晶 王晓敏 陆国权 张朋[3] 林仲康 

机构地区：[1]天津大学材料科学与工程学院,天津300350 [2]中国科学院西安光学精密机械研究所瞬态光学与光子技术国家重点实验室,西安710119 [3]全球能源互联网研究院,北京102200

出　　处：《高电压技术》2017年第10期3307-3312,共6页High Voltage Engineering

基　　金：国家高技术研究发展计划(863计划)(2015AA034501);国家自然科学基金(61334010);天津市科技支撑计划(13ZCZDGX01106);瞬态光学与光子技术国家重点实验室开放课题(SKLST201607)~~

摘　　要：智能电网用压接式绝缘栅双极型晶体管(IGBT)模块主要通过压力接触来实现热耗散,而这种封装散热方式存在界面接触不佳、散热性能差等缺点,导致同等通流能力下芯片的结温偏高,电性能下降,甚至影响其长期可靠性。为了克服这些问题,提出了采用纳米银焊膏作为芯片连接材料替代压力接触与芯片形成电触点的方式,研发了一款针对智能电网的采用纳米银焊膏的烧结式IGBT模块;并表征了烧结式IGBT模块的整体热阻、静态电性能及芯片剪切强度,完成了与商用同等级压接式IGBT模块的性能比对。实验结果显示:烧结式IGBT模块的热阻比压接式IGBT模块下降了15.8%;2种模块的静态电性能的测试结果基本一致,进一步验证了烧结式IGBT模块的封装可行性;对于大面积IGBT芯片(尺寸为13.5 mm×13.5 mm),其连接芯片烧结银接头的剪切强度约为20 MPa,接头质量较高。以上结果说明采用纳米银焊膏封装高压IGBT模块,不仅可以显著降低压接IGBT模块的热阻,同时仍能获得良好的静态电性能。因此,由于其在高压大电流电能运输过程中较高的转换效率及功率密度,烧结式IGBT模块有望应用于智能电网。Interface contact through pressure is the way for press-pack insulated gate bipolar transistor（IGBT） modules in smart grid to conduct heat dissipation.However,the junction temperature of the press-pack IGBT modules could be too high,leading to degradation of electrical properties and even impairing the reliability,because of poor interfacial contact and poor heat dissipation.To overcome the above problems,we developed a sinter-pack IGBT module using nanosilver paste by forming electrical contact with chip to replace pressure contact in press-pack module.Then,the sinter-pack module was characterized by die-shear strength,thermal resistance,and static characteristics to compare with press-pack IGBT module.According to the experimental results,the thermal resistance of sinter-pack IGBT module decreased by 15.8%.The static electricity test results are consistent with two types of modules,further proving the feasibility of sinter-pack IGBT modules.The shear strength is around 20 MPa,indicating a good bonding quality of large area of die（13.5 mm×13.5 mm） with nanosiver paste.It is concluded that nano silver paste employed in press-pack IGBT modules can not only significantly decrease the thermal resistance of press-pack IGBT modules,but also get an excellent static electricity.Thus,a sinter-pack module is expected to be operated in smart grid because of the higher conversion efficiency,power density,and reliability during operating at high voltage and current applications.

关 键 词：纳米银焊膏 压接式IGBT模块 烧结式IGBT模块 热阻 静态电性能测试 剪切测试 

分 类 号：TN322.8[电子电信—物理电子学]