3种芯片分布方式下的LED灯丝的热分析  

Thermal analysis of LED filaments with three types of chip distributions

作　　者：佘君 杨文 于天宝[1,2] 黄建民 SHE Jun YANG Wen YU Tianbao HUANG Jianmin(School of Sciences, Nanchang University, Nanchang 330031, China Jiangxi Lianchuang Opto-electronic Science and Technology Co. LTD, Nanchang 330096, China)

机构地区：[1]南昌大学理学院,江西南昌330031 [2]江西联创光电科技股份有限公司,江西南昌330096

出　　处：《南昌大学学报（工科版）》2017年第3期289-293,306,共6页Journal of Nanchang University(Engineering & Technology)

基　　金：江西省杰出青年基金资助项目;江西省博士后基金资助项目(2015KY40)

摘　　要：为了降低LED灯丝温度,提高其散热性能,采用有限元热学仿真并进行实验验证,对等间距、等差数列、斐波那契数列3种芯片分布方式分别进行热学分析,比较不同芯片排布方式下的LED灯丝的散热性能。结果表明:斐波那契数列和等差数列的芯片分布的散热性能远远优于传统等间距芯片分布,且斐波那契数列分布下的LED灯丝的基板中部温度最低。In order to reduce the temperature of LED filament and improve its heat dissipation,the thermal simulation based on finite element method and experiments for the three types of arrangements of LED chips on LED Lamp Filament,including equidistant columns,arithmetic sequence,Fibonacci sequence,were presented.It discussed the influence of different arrangements of LED chips on LED＇s heat dissipation.The results indicated that the heat dissipation performance for arithmetic sequence and Fibonacci sequence was much better than that of using equidistant columns.And the temperature of the middle part of the filament substrate under Fibonacci sequence was the lowest.

关 键 词：LED灯丝 有限元 热仿真 斐波那契数列 

分 类 号：O472.2[理学—半导体物理]