SEM/EDS鉴别微电子焊点中Cu_6Sn_5的影响因素及改进措施  

The Influence Factors of the Identification for Cu_6Sn_5 Existing in Microelectronics Solder by SEM/EDS and the Improvement Measures

作　　者：付雪涛[1,2] 裴会川 

机构地区：[1]中国电子技术标准化研究院 [2]全国半导体设备和材料标准化技术委员会

出　　处：《信息技术与标准化》2017年第9期71-74,共4页Information Technology & Standardization

摘　　要：为准确鉴定微电子焊点中的Cu_6Sn_5化合物,采用扫描电子显微镜/能谱仪(SEM/EDS),通过组分比值的测量开展Cu_6Sn_5的鉴定试验。试验发现,当SEM工作电压过低时,铜组分测量值将偏高,并且在8 kV工作电压下容易将Cu_6Sn_5误判为Cu_3Sn;当SEM工作电压过高时,锡组分测量值将明显偏高。对影响SEM/EDS鉴定Cu_6Sn_5准确度的因素进行了分析,并从工作电压、测量样本数两个方面优化了鉴定方法。优化后的方法测得Cu_6Sn_5的Cu/Sn为1.2,结果高度准确。In order to identify the Cu6Sn5 compound exited in microelectronic solder, we use the scanning electron microscopy/energy dispersive spectrometer （SEM/EDS） to carry out an identification test for the Cu6Sn5 by composition measurement. Experiments show that the values of Cu will be higher than the standard value when the SEM works in a low voltage, and it will mistakenly identify the Cu6Sn5 as Cu3Sn if the SEM works in 8 kV voltage. The values of Sn will be higher than the standard value when the SEM works in a high voltage. We analyze the influence factors of the accurate degree for identifying the Cu6Sn5 by SEM/EDS, and optimize the measuring method frorn the aspects of working voltage of SEM and the number of samples. The measurement result ofCu/Sn of Cu6Sn5 is 1.2 by the optimized method, which is highly accurate.

关 键 词：扫描电子显微镜 微电子焊接 能谱 金属间化合物 

分 类 号：TN405[电子电信—微电子学与固体电子学]