手机快充端子铜镍硅引线框架材料研究进展  

The Research Development of Cu-Ni-Si Lead Frame Materials for Mobile Phone Fast Charging Connector

作　　者：庞胜乾 黎晓华[1,2] 

机构地区：[1]深圳市特种功能材料重点实验室 [2]深圳大学材料学院

出　　处：《特种铸造及有色合金》2017年第10期1154-1157,共4页Special Casting & Nonferrous Alloys

摘　　要：简述了手机的快充模式与应用,综述引线框架的材料发展。对比了几种常见手机快充端子引线框架材料的力学性能和导电导热性能。介绍了Cu-Ni-Si合金的研究情况,结合主流手机充电端子的设计思路探讨可能发生的失效模式和产生原因,为提高手机Cu-Ni-Si引线框架的品质提出措施。The charging mode and technology application of mobile phone fast charging were described,and development of lead frame material was reviewed.The tensile strength,thermal conductivity,electrical conductivity and thermal expansion coefficient of lead frame materials for mobile phone fast charging connector were analyzed comparatively.The progress of Cu-Ni-Si series alloy was introduced.The possible failure modes and origination were discussed according to the design of the main mobile phone fast charging connector,and the countermeasures were proposed to improve the quality of Cu-Ni-Si lead frame for mobile phone.

关 键 词：手机快充端子 引线框架材料 铜镍硅合金 失效模式 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TG353.11[金属学及工艺—金属材料]