TiO_2溶胶对Cu-Sn镀层微观组织和性能的影响（英文）  

Effect of TiO_2 Sol on the Microstructure and Tribological Properties of Cu-Sn Coating

作　　者：应丽霞 李正辉 吴珂[1] 吕秀鹏 王桂香 

机构地区：[1]哈尔滨工程大学,黑龙江哈尔滨150001

出　　处：《稀有金属材料与工程》2017年第10期2801-2806,共6页Rare Metal Materials and Engineering

基　　金：National Natural Science Foundation of China(51305090)

摘　　要：为了进一步提高Cu-Sn镀层的硬度和耐磨性,在保持镀层自润滑性能的基础上,采用纳米溶胶技术与复合电镀技术相结合的方法,将纳米TiO_2溶胶加入到电解液中,制备了TiO_2纳米粒子强化的Cu-Sn-TiO_2复合镀层。通过对微观组织、成分、显微硬度和摩擦学性能的分析表明,适量纳米TiO_2溶胶的加入,细化了Cu-Sn镀层组织,提高了镀层的致密性,其硬度和耐磨性均较Cu-Sn镀层显著提高。In order to improve the hardness and wear resistance on condition that the self-lubricating property is ensured, Cu-Sn coatings were prepared and strengthened by combining sol-gel method and composite electroplating technology. TiO_2 sol was added to the Cu-Sn electroplating bath to obtain nano-particles reinforced Cu-Sn-TiO_2 composite coatings. The microstructure, composition, microhardness and tribological properties were analyzed. The results show that the introduction of the TiO_2 sol in the plating solution changes the composition and structure of the composite coatings. The co-deposited TiO_2 is uniformly distributed in the Cu-Sn matrix and greatly improves the microhardness and tribological properties of the Cu-Sn coating.

关 键 词：电镀 Cu-Sn TIO2溶胶 摩擦学性能 

分 类 号：TG174.4[金属学及工艺—金属表面处理]