高体积分数SiC_p/Al电子封装复合材料的钎焊综述（英文）  

Review on Brazing of High Volume Faction SiC_p/Al Composites for Electronic Packaging Applications

作　　者：张相召 赵三团 刘桂武[1] 徐紫巍[1] 邵海成[1] 乔冠军[1,2] 

机构地区：[1]江苏大学,江苏镇江212013 [2]西安交通大学金属材料强度国家重点实验室,陕西西安710049

出　　处：《稀有金属材料与工程》2017年第10期2812-2819,共8页Rare Metal Materials and Engineering

基　　金：National Natural Science Foundation of China(51572112);Natural Science Foundation of Jiangsu Province(BK20151340);Six Talent Peaks Project of Jiangsu Province(2014-XL-002);Post Doctorial Science Foundation of China(2014M551512);Innovation/Entrepreneurship Program of Jiangsu Province(SUZUTONG[2013]477 and SURENCAIBAN[2015]26)

摘　　要：高体积分数SiC_p/Al复合材料作为电子封装材料使用日益流行,其钎焊具有重要的实际意义。近来,一些新钎料合金和工艺被开发用于高体积分数SiC_p/Al复合材料的钎焊。本文回顾了SiC_p/Al复合材料的物理力学性能和制备工艺,综述了应用于高体积分数SiC_p/Al复合材料的合金钎料、钎焊工艺及其接头微结构与性能,旨在进一步理解它们之间的关联性,以优化接头性能与可靠性。往Al-Si合金中添加Cu、Mg、Ni等合金元素有助于提高钎料合金和钎焊接头的使用性能,如可优化钎料合金的应用温度、接头界面结合和焊缝强度。而表面金属化和超声波振动两种钎焊辅助工艺可通过避免或去除复合材料表面的Al_2O_3和SiO_2氧化膜来改善合金钎料的钎焊性。最后指出,需要进一步加强对合金钎料的优化设计、表面金属化工艺以及焊料/涂层/基材体系之间的润湿性和界面行为的研究。High volume faction（HFC, ≥50%） SiC_p/Al composites are becoming increasingly popular as the electronic packaging materials, and the brazing of them is therefore of great practical importance. Recently, some new filler metal alloys and processes have been developed for effectively brazing the HFC SiC_p/Al composites. Starting from a survey of physical and mechanical properties and fabrication process of the HFC SiC_p/Al composites, the filler metal, brazing process as well as the corresponding joint microstructures and strength are reviewed for understanding their relationships in order to improve the joining technique and joint reliability. The additions of Cu, Mg and Ni into Al-Si based alloy can contribute to improve the performances of filler metal and/or joint, such as the operating temperature of filler metal, interfacial bonding and brazing seam strength. Two assisted procedures involving surface metallization and ultrasonic vibration can optimize the brazability by avoiding or removing the inevitable oxide films（Al_2O_3 and SiO_2） on the surface of HFC SiC_p/Al composites. The need of further investigations, covering optimization design of filler metal, surface metallization process as well as wettability and interfacial behavior of filler-coating-SiC_p/Al substrate system are strongly underlined.

关 键 词：高体积分数SiCp/Al复合材料 钎料 表面金属化 钎焊 界面 接头力学性能 

分 类 号：TB33[一般工业技术—材料科学与工程] TG454[金属学及工艺—焊接]