光模块中刚柔线路板电连接宽带阻抗匹配研究  

Research on Broadband Impedance Matching of Rigid-flex Printed Circuit Board Interconnection in the Optical Transceiver Module

作　　者：杨立杰[1,2] 刘丰满 周鸣昊[3] 李宝霞 陆原 曹立强[1,2,3] 谭同[1,2] 

机构地区：[1]中国科学院微电子研究所,北京100029 [2]中国科学院大学,北京100049 [3]华进半导体封装先导技术研发中心有限公司,江苏无锡214135 [4]西安微电子技术研究所,西安710065

出　　处：《半导体光电》2017年第5期699-704,共6页Semiconductor Optoelectronics

基　　金：国家"863"计划项目(2015AA016904)

摘　　要：文章分别对光收发组件中50Ω柔性线路板和50Ω刚性线路板,以及25Ω柔性线路板和50Ω刚性线路板间的电互连阻抗匹配进行了设计、仿真与实验验证。对于50Ω_50Ω刚柔板的高频连接,通过对其返回路径的通孔位置优化设计,使反射损耗S11在高频段降低约11%,插入损耗S21减小19%;对于25Ω_50Ω刚柔板的高频连接,提出新的优化方式:在硬板信号线的金手指上做通孔设计,并提取该结构的寄生参数,构建电路模型。该结构大幅提高了连接处容性阻抗,降低了阻抗失配,使得S11在高频段降低约38.2%,S21减小约34%。提出的柔性线路板与刚性线路板的电互连方式,能实现传输线间的阻抗匹配,减小信号反射和插入损耗,提高光模块传输质量,对于光器件的接入具有较大应用价值。This study mainly focuses on the design,simulation and verification of impedance matching of the rigid-flex printed circuit board interconnections,including 50Ωflexible PCB and50Ωrigid PCB,as well as 25Ωflexible PCB and 50Ωrigid PCB.For 50Ωflexible PCB and 50Ωrigid PCB interconnection,the positions of ground vias in the return path were optimized,and reflection loss S11 and insertion loss S21 were reduced by about 11% and 19% respectively in the high frequency band.For 25Ωflexible PCB and 50Ωrigid PCB,a novel structure was presented,in which there were two vias in the high-speed signal transmission line of the PCB.Capacitance was increased effectively because of the vias and ground planes.S11 and S21were reduced by about38.2% and 34% respectively in the high frequency band.The connection structure of the rigidflex PCB reported in this article,can improve signal quality of the optical transceiver module,and shows broad application prospects.

关 键 词：柔性线路板 刚性线路板 阻抗匹配 信号完整性 

分 类 号：TN41[电子电信—微电子学与固体电子学]