电化学方法在无氰碱性镀铜研究中的应用  

Application of Electrochemical Methods in Study of Non-cyanide Alkaline Copper Plating

作　　者：范佳利[1] 李维[1] 屈云[1] 郑国伟[1] 

机构地区：[1]湖北兴发化工集团股份有限公司,功能性磷酸盐宜昌市重点实验室,湖北宜昌443000

出　　处：《化工技术与开发》2017年第11期33-35,共3页Technology & Development of Chemical Industry

摘　　要：本文系统分析了电化学方法在焦磷酸盐、HEDP(羟基乙叉二膦酸)、柠檬酸盐、EDTA(乙二胺四乙酸)等无氰碱性镀铜研究中的应用,并指出后续无氰镀铜研究不仅应注重添加剂或第二配体引入对工艺的影响,更要善于借助电化学等有效辅助手段进行分析,以期促进无氰碱性镀铜工艺取得更大的突破。Electrochemical methods for the study of non-cyanide alkaline copper plating in EDTA, citrate, HEDP and pyrophosphates baths were analyzed systematically. And it was pointed out that the future research should not only focus on non-cyanide copper plating additives or second ligand on the impact of technology, but also to be good at analysis by means of electrochemical auxiliary means, in order to promote the process of non-cyanide alkaline copper plating to achieve greater breakthroughs.

关 键 词：焦磷酸盐 羟基乙叉二膦酸 柠檬酸盐 乙二胺四乙酸 无氰碱性镀铜 电化学 

分 类 号：TQ153.14[化学工程—电化学工业]