铜铝复合板界面相生长行为  

Behavior of interface phase growth of Cu/Al composite plate

作　　者：吕世敬 谢敬佩[1,2] 王爱琴 毛志平[3] 刘帅洋[1] 田捍卫 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]有色金属共性技术河南省协同创新中心,河南洛阳471023 [3]郑州大学物理工程学院,河南郑州450001

出　　处：《材料热处理学报》2017年第11期28-33,共6页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(U1604251)

摘　　要：采用铸轧法制备了铜铝复合板,利用SEM,EDS和XRD等分析手段研究了其在300~500℃热处理0.5~8 h下界面层的微观结构和物相成分,从扩散动力学和相变热力学角度探讨了界面相的形成和长大机制。结果表明:铸轧法生产的铜铝复合板界面为3层结构,从铜侧到铝侧依次为Al_4Cu_9层、AlCu层和Al_2Cu层;各界面层扩散系数与温度满足Arrhenius关系,Al_4Cu_9层、AlCu层、Al_2Cu层及整个界面层的生长激活能分别为119.789,94.986,89.259和102.084 k J/mol;在扩散动力学和相变热力学共同作用下,界面处Al_2Cu相最先生成,其次为Al_4Cu_9相,随后在两者之间生成AlCu相。Microstructure and phase composition of interface layer of Cu/Al composite plate prepared by roll-casting process after heat treatment at 300-500 ℃ for 0. 5-8 h were investigated by means of SEM,EDS analysis and XRD. The formation and growth mechanism of the interface phase were discussed from the point of view of diffusion kinetics and phase transition thermodynamics. The results show that the interface of the Cu/Al composite plate produced by roll-casting process is a three-layer structure,and the Al4Cu9 layer,AlCu layer and Al2Cu layer are successively followed from the Cu side to the Al side. The diffusion coefficient of each interface layer and temperature satisfy the Arrhenius relation,and the growth activation energies of the Al4Cu9 layer,AlCu layer,Al2Cu layer and the total interface layer are 119. 789,94. 986,89. 259 and 102. 084 k J/mol,respectively. Under the combined action of diffusion kinetics and phase transition thermodynamics,the Al2Cu phase at the interface is first formed,followed by the Al4Cu9 phase,and then the Al Cu phase is formed between the two phases.

关 键 词：铜铝复合板 界面相 扩散动力学 相变热力学 

分 类 号：TB331[一般工业技术—材料科学与工程] TG146.1[金属学及工艺—金属材料]