Cu和Ni原子在高熵合金CuCoCrFeNi中的扩散行为  

Diffusion behavior of Cu and Ni atoms in CuCoCrFe Ni high entropy alloy

作　　者：陶文静 张伟强[1] 付华萌[2] 

机构地区：[1]沈阳理工大学材料科学与工程学院,辽宁沈阳110159 [2]中科院沈阳金属研究所,辽宁沈阳110016

出　　处：《材料热处理学报》2017年第11期34-39,共6页Transactions of Materials and Heat Treatment

基　　金：国家重点基础研究发展计划(2011CB610405)

摘　　要：研究了CuCoCrFeNi高熵合金在镀镍和镀铜并经不同温度退火不同时间后扩散层的显微组织、成分以及扩散层厚度。结果表明,Cu原子在CuCoCrFeNi高熵合金中不易发生晶格扩散,但经高温或长时间热处理后,Cu原子可在晶界处发生扩散。Ni原子与高熵合金中的组元发生了明显的互扩散;Cu和Ni原子在高熵合金中的扩散是空位机制,只有"适配空位"才能为原子在高熵合金中提供迁移的位置。显微硬度测试结果表明,Cu/高熵合金界面处显微硬度较低,而Ni/高熵合金界面处显微硬度逐渐提高。Microstructure, composition and thickness of diffusion layer of a high entropy CuCoCrFeNi alloy in the process of nickel plating and copper plating and then annealed at different temperatures for different time were studied. The results show that the Cu atoms do not occur lattice diffusion in the CuCoCrFeNi alloy, but Cu atoms can diffuse at grain boundaries after annealing at high temperature or annealing for long time. Interdiffusion is observed between the Ni atoms and other components in the alloy. The diffusion mechanism of the Cu and Ni atoms in the high entropy alloy is vacancy-assisted diffusion and only the adaptable vacancies can proved the possible positions for those diffusing atoms. Microhardness test results show that the microhardness of the interface of the Cu/high entropy alloy is low, while the mierohardness of the interface of the Ni/high entropy alloy is gradually improved after annealing.

关 键 词：高熵合金 扩散 适配空位 显微硬度 

分 类 号：TG111.6[金属学及工艺—物理冶金]