连接温度对Ti中间层钼/铜异种金属扩散焊接接头组织性能的影响  

Effects of Bonding Temperature on Microstructure and Properties of Mo/Cu Dissimilar Metals Diffusion Bonding Joint with Ti as Intermediate Layer

作　　者：姚智 孔见[1] 孙宁 张琦 周琦[1] 张德库[1] 

机构地区：[1]南京理工大学材料科学与工程学院,江苏南京210094 [2]中国兵器工业新技术推广研究所,北京100089 [3]河南江河机械有限公司,河南平顶山467337

出　　处：《热加工工艺》2017年第21期244-246,250,共4页Hot Working Technology

摘　　要：以Ti箔作为中间层,采用瞬间液相扩散焊接的方式焊接Mo和Cu,研究了连接温度对焊接接头显微组织及剪切强度的影响。结果表明,连接温度较低时,扩散连接接头的的界面呈分层结构,随着连接温度的升高,Ti、Cu及Ti、Mo相互扩散反应,获得了良好的焊接接头。接头的剪切强度随连接温度升高逐渐增大。1030℃时,接头的剪切强度达到180.3 MPa,断裂发生在Mo母材。The Mo and Cu were joined by transient liquid phase diffusion bonding with Ti foil as intermediate layer, and the effects of bonding temperature on the microstructure and shear strength were investigated. The results show that when the bonding temperature is low, the diffusion bonding interface presents a layered structure. With the increase of the bonding temperature, Ti, Cu and Ti, Mo diffuse and react mutually, and good welded joints are obtained. The shear strength increases with the increase of bonding temperature. When the temperature is 1030℃, the shear strength of the joint reaches 180.3 MPa, and the fracture occurs in Mo base metal.

关 键 词：瞬间液相扩散焊 连接温度 钼与铜 剪切强度 

分 类 号：TG453.9[金属学及工艺—焊接]