固定化生物吸附剂处理含铜电镀废水的研究  

Study on Treatment of Electroplating Wastewater Containing Copper by Immobilized Bio-adsorbent

作　　者：张金东[1] 

机构地区：[1]盘锦职业技术学院石油工程系,辽宁盘锦124000

出　　处：《电镀与环保》2017年第6期66-69,共4页Electroplating & Pollution Control

摘　　要：通过平板涂布法,从电镀污泥中筛选得到1株吸附Cu^(2+)性能优良的菌株,鉴定其为假单胞菌,并将其制成固定化生物吸附剂。研究了包埋比、吸附时间、温度、Cu^(2+)初始质量浓度、pH值、投加量对固定化生物吸附剂去除Cu^(2+)的影响。结果表明:当包埋比为1∶5、吸附时间为60min、温度为35℃、Cu^(2+)初始质量浓度为100mg/L、pH值为6、投加量为10g/L时,固定化生物吸附剂对Cu^(2+)的去除率可达到85.2%。A bacterial strain with electroplating sludge using plate good adsorption performance for Cu^2＋ was screened from smearing method. This bacterial strain is identified as pseudomonas, and it was made into immobilized bio-adsorbent. The effects of embedding ratio, adsorption time, temperature, Cu^2＋ initial mass concentration, pH value and dosage on the removal efficiency of Cu^2＋ by immobilized bio-adsorbent were studied. Results showed that the removal efficiency of Cu^2＋ could reach 85.2% when embedding ratio was 1 ： 5, adsorption time was 60 min, temperature was 35 ℃, Cu^2＋ initial mass concentration was 100 mg/L, pH was 6 and dosage was 10 g/L.

关 键 词：固定化生物吸附剂 含铜电镀废水 筛选 去除率 

分 类 号：X781.1[环境科学与工程—环境工程]