基于多层板过孔互连结构的小型化微波整流电路设计  

Design of a miniaturized rectifying circuit with a via-hole interconnected multilayer structure

作　　者：冯小平[1] 黄卡玛[1] FENG Xiao-Ping;HUANG Ka-Ma(College of Electronics and Information Engineering, Sichuan University, Chengdu 610064, China)

机构地区：[1]四川大学电子信息学院,成都610064

出　　处：《四川大学学报（自然科学版）》2017年第6期1217-1221,共5页Journal of Sichuan University(Natural Science Edition)

基　　金：国家重点基础研究发展"973计划"(2013CB328902;2013CB328905)

摘　　要：设计了一种新颖的基于多层结构的微波整流电路,在该电路中使用过孔连接多层板的各导体层.在此基础上,加工了基于HSMS-282C肖特基二极管的S波段多层整流电路,其微波到直流转换效率达到73%.与传统的微带整流电路相比,多层整流电路与其转换效率相近且能极大地减小电路物理尺寸.实验结果表明,本文采用的多层整流电路能够在不牺牲整流效率的前提下,实现小型化的目标,从而满足微波无线输能系统的大规模集成及小型化需求.This article proposes a novel concept for constructing a microwave （MW） rectifying circuit by using a multilayer structure, aiming at reducing physical dimensions. Specifically, conductor layers in the multilayer structure are interconnected with an embedded via-hole. Then, an S-band rectifying circuit based on HSMS-282C Schottky diode is fabricated with the proposed multilayer structure for demonstration. The maximum MW-DC conversion efficiency of 73% has been measured. In comparison with the conventional microstrip rectifying circuit, the proposed multilayer circuit shows a great reduction of physical dimensions and a very similar efficiency, which validates that the proposed circuit can reduce physical dimensions significantly without sacrificing the MW-DC conversion efficiency.

关 键 词：整流电路 小型化 多层 过孔 转换效率 

分 类 号：TN61[电子电信—电路与系统]