纳米AlN颗粒弥散增强铜基复合材料的制备及性能研究  

Preparation and properties of nano-AlN particle dispersion strengthened Cu-matrix composite

作　　者：刘佳思 纪箴[1] 贾成厂 张一帆[1] 刘博文 周川 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083 [2]北京科技大学新材料技术研究院,北京100083

出　　处：《粉末冶金技术》2017年第5期323-327,共5页Powder Metallurgy Technology

基　　金：国家重点基础研究发展规划(973计划)资助项目(2014GB120000);国家自然科学基金资助项目(51471023)

摘　　要：本文采用高能球磨结合放电等离子烧结法制备了含不同质量分数AlN的AlN/Cu复合材料。研究了AlN质量分数对AlN/Cu复合材料微观形貌、相对密度、显微维氏硬度、拉伸强度、延伸率及导电性能的影响。结果表明:当AlN质量分数<1.0%时,随着AlN质量分数的提高,复合材料的硬度、抗拉强度提高,断后伸长率、电导率降低。但当AlN质量分数为1.0%时,AlN/Cu复合材料相对密度为97.8%,显微硬度和抗拉强度分别达到了HV 119.5和259.7 MPa,电导率为49.30 mS·m^(-1),综合性能达到最优。Cu-matrix composite dispersion strengthened by AlN with different AlN mass fraction was prepared by mechanical ball milling and spark plasma sintering. The effects of AlN contents on the microstructure, relative density, hardness, tensile property, and electrical conductivity of AlN/Cu composites were investigated. The results show that, when AlN mass fraction is less than 1.0%,the hardness and tensile strength are improved, while the elongation and conductivity decrease with the increase of AlN mass fraction. The relative density, hardness, tensile strength, and electrical conductivity of 1.0% AlN/Cu composites are 97.8%, HV 119.5, 259.7 MPa, and 49.30 mS·m^（–1）, respectively.

关 键 词：放电等离子烧结 CU基复合材料 维氏硬度 抗拉强度 电导率 

分 类 号：TB331[一般工业技术—材料科学与工程]