玻纤布基覆铜板基材冲孔特性及其测试方法的研究  

Study on punching characteristics of glass fiber cloth-based copper clad laminate substrate and its test method

作　　者：吕吉[1] 张艳华[1] 

机构地区：[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《印制电路信息》2017年第12期21-24,共4页Printed Circuit Information

摘　　要：本文设计了适合玻纤布基覆铜板基材冲孔性能的模具,在固定实验参数的情况下,根据冲孔不同间距是否泛白分层来表征冲孔性能。冲孔时,方形孔更易泛白分层,圆形孔次之,菱形孔再次之,这与纸基覆铜板不同,属于玻纤布基覆铜板特有。This paper designed a mold for the punching performance of the base material of glass fiber cloth-based Copper Clad Laminate（CCL） substrate. In the case of fixed experimental parameters, the punching performance is characterized by judging the degree of whitening and delamination Occurrence associated with punching of different spacing. After punching, the square hole is the easiest to whitening, the round hole is the second, and the diamond shaped hole is the third. Unlike paper-based CCL, it belongs to unique characteristics of glass fiber cloth based CCL.

关 键 词：玻纤布基覆铜板基材 冲孔性 模具 

分 类 号：TN41[电子电信—微电子学与固体电子学]