成分和热处理温度对酚醛树脂基粘结剂粘结性能的影响  

The Effects of Components and Heat Treatment Temperature on Bond Property for Phenolic Resin-Based Adhesive

作　　者：张峰[1] 王广海[1] 张世超[1] 孙浩然[1] 胡传奇[1] 陈玉峰[1] 

机构地区：[1]中国建筑材料科学研究总院,北京100024

出　　处：《陶瓷学报》2017年第5期688-691,共4页Journal of Ceramics

摘　　要：本文介绍以热固性酚醛树脂为基体,分别添加氧化硅、硼化锆、碳化硼作改性填料,制备不同成分的酚醛树脂基粘结剂。不同成分的粘结剂分别对碳化硅材料进行粘接,低温下(150℃)固化。在惰性气氛下,对样品进行不同温度(400℃,800℃,1200℃,1500℃)的热处理。测试热处理后样品的粘结强度,用光学显微镜和扫描电镜观察样品表面形貌,研究改性填料和热处理温度对酚醛树脂基粘结剂粘结强度的影响。结果表明,碳化硼改性酚醛树脂基粘结剂粘结强度较高。热处理温度在1200℃以上时,随碳化硼加入量增加,粘结强度增大。In this paper, the high temperature binder was prepared by dissolving different components, such as silica, zirconium diboride and boron carbide. After low temperature（150 ℃ or less） curing, Si C samples were bonded by the binder. The samples were subjected to treat at different temperatures（400 ℃, 800 ℃, 1200 ℃, 1500 ℃） under an inert atmosphere. The microstructures of the samples were observed by optical microscope and scanning electron microscope. The effects of the modified filler and heat treatment temperature on the bond strength of the phenolic resin based adhesive were investigated. The results show that the bonding strength of the boron carbide modified phenolic resin based adhesive is high. When the heat treatment temperature is above 1200 ℃, the bond strength increases with the addition of boron carbide.

关 键 词：酚醛树脂 改性 温度 粘结强度 

分 类 号：TQ174.75[化学工程—陶瓷工业]