用气相MCVD铜-胍基技术制作陶瓷板  

Preparative process of ceramic PCB with Multi-beam Chemical Vapor Deposition[Cu(iPr-gruan)]_2 technology

作　　者：刘镇权 邬通芳 吴培常 

机构地区：[1]广东成德电子科技股份有限公司,广东佛山528300

出　　处：《印制电路信息》2017年第11期30-39,共10页Printed Circuit Information

摘　　要：用气相MCVD铜-胍基技术制作的陶瓷板不含有机组分,具有优异的热可靠性和导电性能,同时它还具有很高的抗电迁移能力,介电损耗角也低于0.001和耐宇宙射线的能力,完全适合于航天航空用。This paper discusses the employed multi-beam chemical vapor deposition [Cu（iPr-gruan）]_2 system having independently-regulated two or above radial sources and one ion source.Using this system,the effects of each active species on nucleation and vertical growth of cuprous patterns on ceramic substrate are obtained.Ceramic printed circuit board possesses excellent electricity function and thermal conductivity,have higher CAF migration ability,meanwhile its loss tangent is less than 0.001 and is completely suitable for aerospace

关 键 词：陶瓷板 前驱体 气相MCVD 直接覆铜陶瓷基板 

分 类 号：TN41[电子电信—微电子学与固体电子学]