AlN陶瓷基板化学镀金前处理工艺研究  

Research of Pre- treatment for Electroless Gold Plating Process on AIN Ceramic Substrate

作　　者：胡玲[1] 周波 杨磊[1] 

机构地区：[1]中国电子科技集团公司第43研究所

出　　处：《混合微电子技术》2016年第3期59-63,共5页Hybrid Microelectronics Technology

摘　　要：描述了AlN陶瓷基板化学镀金工艺技术。对基板线条进行二次金属化，获得镍金膜层结构以满足键合、焊接等使用要求。研究了AlN陶瓷基板化学镀金过程中，前处理镀液对陶瓷基板表面形貌的影响并利用扫描电镜（SEM）手段进行表征。本文主要讨论了除油、钯活化、超声清洗工序并分析了常见缺陷如漏镀、渗镀产生的原因及影响因素。The electroless gold plating technology of AlN ceramic substrate is described in this paper. Theseeondary metallization of ceramic surface line is carried out to obtain Ni - Au film layer structure to satisfy the requirements of gold wire bonding and soldering. The impact of pre - processing solution to surface topography of cemamic substrate in the process of electroless plating is studied, and the topography were characterized by means of SEM. This paper mainly discusses the degreasing, palladium activation and ultrasonic cleaning processes and analyzes the causes and influencing factors of common defects such as leak- age plating and diffusion plating.

关 键 词：AlN陶瓷基板 前处理 过腐蚀 漏镀 渗镀 

分 类 号：TG166.7[金属学及工艺—热处理]