不同黏结剂聚晶金刚石晶粒界面研究进展  

Research status of grain interface in polycrystalline diamond with different binders

作　　者：衡军 骈小璇 史春燕 秦伟丽 栗正新[2] 栗晓龙[2] HENG Jun;PlAN Xiaoxuan;SHI Chunyan;QIN Weili;LI Zhengxin;LI Xiaolong(Zhengzhou New Asia Superhard Material Composite Co., Ltd., Zhengzhou 45001, China;College of Materials Science and Engineer, Henan University of Technology, Zhengzhou 45001, China)

机构地区：[1]郑州新亚复合超硬材料有限公司,郑州450001 [2]河南工业大学材料科学与工程学院,郑州450001

出　　处：《金刚石与磨料磨具工程》2017年第5期74-78,92,共6页Diamond & Abrasives Engineering

摘　　要：影响聚晶金刚石(polycrystalline diamond,PCD)性能的因素有很多,其中最重要的就是黏结剂与金刚石晶粒的界面结合情况。本文综述了常见的Co、Ni等金属型黏结剂及SiC、B等非金属黏结剂与金刚石界面的结合情况、内部界面的存在状态和其作用原理。最终得出聚晶金刚石用黏结剂的选择原则:润湿性、高温界面化学反应、化学性能稳定等;聚晶金刚石用黏结剂的发展方向:通过调控金刚石与结合剂界面来满足不同的性能需求。There are many factors affecting the performance of bonding of binder and diamond grain. The paper summarizes Co, Ni and nonmetal binder such as Si, B in the presence of interface, the interface state and its principle, and finally selection principle and development direction of binder PCD, the most i the performance internal state of mportant is the interface of metal binder such as polycrystalline draws the polycrystalline diamond with

关 键 词：聚晶金刚石 金属黏结剂 陶瓷黏结剂 

分 类 号：TQ164[化学工程—高温制品工业] TG74[金属学及工艺—刀具与模具]