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机构地区:[1]中国电子科技集团公司第五十四研究所,河北石家庄050081
出 处:《电子元件与材料》2018年第1期71-76,共6页Electronic Components And Materials
基 金:国家自然科学基金资助项目(61404119)
摘 要:针对封装级多电源分配网络的噪声隔离难题,对封装级电源非连续平面结构的电源完整性进行了研究。建立了基于非正交三维空间变换的电源非连续平面结构等效电路模型,并运用保角变换等共形映射的方法进行了分离单元间互耦电容和电感的提取。基于本文建立的电路模型与提取的电路参数计算结果,设计了表贴式去耦电容的拓扑方案。最后,基于上述理论模型,采用LTCC技术和Si P封装技术,成功研制出了一款集成多电源的多功能模块。实测结果表明,研制出的模块的电源纹波小于10 m V,噪声隔离性能优异。This paper thoroughly studied the power integrity of a discontinuous plane structure, which aimed at theproblem of noise isolation for multi-power distribution network in package level. An equivalent circuit model, fordiscontinuous plane structure, based on nonorthogonal three dimensional space transform, was built. The mutual couplingcapacitance and inductance among the elements were extracted by the conformal transform and conformal mapping. Atopology scheme of decoupling capacitor was designed, based on the circuit model and the extracted parametersestablished in this paper. Finally, based on the above theoretical model, a multifunctional module was successfullydeveloped using LTCC technology and system in package (SiP) technology. Measured results show that the power supplyripple of the module is less than 10 mV, and the noise isolation performance is excellent.
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