退火处理对过饱和Cu-Mo合金膜微观结构的影响  

Effects of Annealing Treatment on Microstructures of Cu-Mo Alloy Films

作　　者：何孟杰 李亚星 赵德龙 孙浩亮[1] 王广欣[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023

出　　处：《河南科技大学学报（自然科学版）》2018年第2期1-5,共5页Journal of Henan University of Science And Technology:Natural Science

基　　金：国家自然科学基金项目(U1204521);河南科技大学大学生研究训练计划(SRTP)基金项目(2016017)

摘　　要：采用磁控溅射方法在柔性聚酰亚胺(PI)基体上沉积了Cu-Mo合金薄膜,对样品进行了真空退火处理。利用X射线、场发射扫描电镜、能谱仪表征了退火前后合金膜及纯Cu膜的成分、物相结构、表面形貌,分析了退火处理对合金膜微观结构的影响以及退火后合金膜表面Cu颗粒的形成机理。研究结果表明:退火处理后合金膜微观结构发生了明显变化。退火后Cu-21.3%Mo合金膜表面自形成了大量多面体Cu颗粒,颗粒尺寸为几十纳米到数百纳米,并且随着退火温度逐渐升高,薄膜表面自形成颗粒数量逐渐增加。Cu-Mo alloy thin films were deposited on flexible polyimide( PI) substrate by magnetron sputtering method.The Cu-Mo alloy thin films were annealed in situ vacuum at different temperatures. The composition,phase structure and surface morphology of the thin films,before and after annealing,were characterized by Xray,field emission scanning electron microscopy and energy dispersive spectrometer. The effects of annealing treatment on the microstructure of the alloy film were analyzed,and the formation mechanism of Cu particles on the surface of the Cu-21.3% Mo alloy films after annealing was anslyzed. The results show that the microstructure of the alloy films is changed significantly after annealing.A large number of uniformly distributed copper particles with the size of tens of nanometers to hundreds of nanometers grow spontaneously on the surface of the annealed Cu-21. 3% Mo alloy films. Furthermore,as the annealing temperature gradually increases,the number of particles on the surface of the alloy film gradually increase.

关 键 词：柔性基体 铜合金膜 退火 残余应力 颗粒 

分 类 号：TB43[一般工业技术] TG146.411[一般工业技术—材料科学与工程]