低温下高均匀钨铜合金的制备及性能研究  

Research on Preparation and Properties of Low Temperature of High Uniform W-Cu Alloy

作　　者：王君龙[1] 

机构地区：[1]渭南师范学院,陕西渭南714099

出　　处：《渭南师范学院学报》2017年第24期20-25,53,共7页Journal of Weinan Normal University

基　　金：陕西省军民融合研究基金项目:无机纳米材料的表面有机化对复合材料综合性能的影响(17JMR22)

摘　　要：以理论计算为指导,进行了试验验证,研究了平均粒径为8~10μm的W粉坯压成型密度随铜钨合金件冷等静压成型压力的变化关系,以黄培云理论为基础推导出了两者之间的方程式,利用所推导出的方程式,选择合适的压制成型参数,通过1 550℃烧结W骨架和熔渗的方法制备了含Cu量在20 wt.%的Cu W复合材料,通过SEM和TEM观察了原料W粉体、W骨架及Cu W合金的显微组织,并测量了密度、硬度和电导率。结果表明,平均粒径为8~10μm的W粉完全符合冷等静压压制压力与压坯密度的黄培云双对数方程,采用250 MPa压力,经过1 550℃烧结W骨架后制备的Cu W合金含Cu量为20%,布氏硬度达到了227 HB,电导率为33.8%(IACS),热导率为196 W·m-1·K-1。The relationship between pressing pressures and pressed densities of W powders with average size of 8 ~ 10μm was studied systemically by combining theoretical calculation with experiment analysis and the equation between them was deducted basis on Huang's formation theory. The microstructure of W alloy and WCu alloy skeleton,material W powder was observed by SEM and TEM,According to the equation the molding parameter was chosen to prepare the W-20 Cu composite materials with the method of W-skeleton sintered at 1550℃ and infiltrate. The results showed that the relationship between pressing pressures and pressed densities of W powders under isostatic cool pressing accords fully with Huang's formation theory. The Cu content of Cu W composite prepared by isostatic cool pressing(250 MPa) and infiltration is 20%,electric conductivity is 33.8%(IACS),the HB hardness is 227 and the thermal conductivity is 196 W·m^(-1)·K^(-1).

关 键 词：冷等静压 压制压力 低温 密度 熔渗法 

分 类 号：TB331[一般工业技术—材料科学与工程]