脱合金化制备纳米多孔Cu-Ni薄膜  

Preparation of nano-porous Cu-Ni films by means of dealloying

作　　者：周琦[1] 冯基伟 李大鹏[1] 

机构地区：[1]兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,甘肃兰州730050

出　　处：《兰州理工大学学报》2017年第6期1-5,共5页Journal of Lanzhou University of Technology

基　　金：国家自然科学基金(51661018)

摘　　要：以薄铜片为基底,共沉积制备了纳米Cu-Ni-Zn薄膜,经化学和电化学脱合金除Zn得到纳米多孔Cu-Ni薄膜.通过XRD、SEM等技术进行表征,并测定其显微硬度.结果表明:化学脱合金化所得纳米多孔Cu-Ni薄膜微观结构呈圆球颗粒状,孔径尺寸约500nm,与电化学脱合金化相比形貌更规则;纳米多孔Cu-Ni薄膜显微硬度达到113HV.Taking thin copper sheet as substrate, nano-porous Cu-Ni-Zn film was prepared by means of codeposition and the nano-porous Cu-Ni film was obtained through chemical plus electrochemical dealloying to get rid of Zn. Its surface morphology and structure were characterized with scanning electric microscopy and X-ray diffractometry, and its microhardness was measured. The result showed that the chertiically dealloyed nano-porous Cu-Ni film would have a spherical particle microstructure. Its aperture size would be about 500 nm. Compared with electrochemical dealloying, its morphology would be more regular and its microhardness would amount to 113 HV.

关 键 词：共沉积 脱合金化 纳米多孔Cu-Ni薄膜 

分 类 号：TG146.11[一般工业技术—材料科学与工程]