有机溶剂保护对Al/Ni扩散连接的影响规律研究  

Influence of Organic Solvent Surface Protection on Diffusion Bonding of Pure Aluminum to Pure Nickel

作　　者：李瑞[1] 曹健[1] 王义峰[1] 代翔宇[1] 冯吉才[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,黑龙江哈尔滨150001

出　　处：《稀有金属材料与工程》2017年第12期3849-3852,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51275133)

摘　　要：采用有机溶剂保护实现了纯铝和纯镍的扩散连接。利用扫描电子显微镜、能谱分析以及X射线衍射等分析手段,确定了Al/Ni扩散连接接头典型的界面结构为Al/Al_3Ni_2/Ni。在扩散连接过程中利用有机溶剂防止铝表面发生二次氧化,相比直接扩散连接可得到更好的焊接质量。研究了连接温度对Al/Ni接头界面结构的影响规律,随着连接温度的升高各反应层厚度逐渐增加。当连接温度为490℃,连接时间为60 min,连接压力为2 MPa时,接头抗剪强度达到最大值,为17.83 MPa,比该工艺下直接扩散连接得到的焊接接头强度提高了约55%。Diffusion bonding of pure aluminum to pure nickel by organic solvent surface protection was investigated at various temperatures.The interfacial microstructure of Al/Ni diffusion bonded joint was confirmed to be Al/Al3Ni2/Ni by scanning electron microscope,energy spectrum analysis and X-ray diffraction（XRD） analysis.The organic solvent was used to protect the ＂clean surface＂ against re-oxidation prior to diffusion bonding.Under optimum conditions,the joints with higher shear strength were obtained.As the temperature increases,the thickness of the reaction layers increases gradually.The highest shear strength obtained by organic solvent surface protection bonding is 17.83 MPa under 2 MPa for 60 min at 490°C,which is 55% higher than those obtained by conventional diffusion bonding.

关 键 词：扩散连接 表面保护 界面结构 力学性能 

分 类 号：TG40[金属学及工艺—焊接]