基于Moldflow的继电器壳架注塑成型数值模拟及工艺优化  

The Relay Shell Molding Numerical Simulation and Process Optimization Based on Moldflow

作　　者：陈振[1] 黄勇[1] 李鑫[1] 

机构地区：[1]沈阳理工大学材料科学与工程学院,沈阳110159

出　　处：《沈阳理工大学学报》2017年第5期90-94,共5页Journal of Shenyang Ligong University

摘　　要：根据继电器壳架件结构特点,利用Moldflow和CAD等软件进行数值模拟和工艺优化,设计浇注系统和冷却系统。依据壳架体积收缩率和翘曲变形大小为质量鉴定指标,设计DOE正交实验方案,得到优化的工艺组合为:熔体温度285℃,模具温度90℃,注射时间为1.2s,保压时间为二段保压10s,压力为注射压力的85%。通过实际生产得到了合格的继电器壳架产品,验证了模拟结果的正确性,可以进行注塑生产。According to the structural characteristics of relay shell parts,the numerical simu-lation and process optimization were designed based on the software of Moldflow and CAD. The gating system and cooling system were established. According to the shrinkage rate of the shell and the size of the warping deformation,the DOE orthogonal experiment was de-signed. The optimized process combination was：the melt temperature 285℃;mold tempera-ture 90℃;injection time 1. 2s;holding time 10s,the pressure 85% of the injection pressure. Through production practice the qualified relay shell products can be obtained,the correct-ness of the simulation results can be validated. Injection molding can be used in production.

关 键 词：继电器 数值模拟 DOE 生产实践 

分 类 号：TB324[一般工业技术—材料科学与工程]