大功率紫外LED水冷设计及模拟优化  

Design and Optimization of an UV-LED Water-Cooled Panel Model

作　　者：王杰 李健 范冰丰 王钢 

机构地区：[1]中山大学电子与信息工程学院,广东广州510000 [2]中山大学先进技术研究院,广东广州510275 [3]光电材料与技术国家重点实验室,广东广州510275

出　　处：《机械设计与制造》2018年第1期212-214,218,共4页Machinery Design & Manufacture

基　　金：国家自然科学基金-NSFC-广东联合基金(U1201254);国家自然科学基金-青年科学基金项目(51402366)

摘　　要：半导体器件追求大功率和体积小型化的同时,半导体芯片的散热成为制约其可靠性和稳定性的重要因素,如果不能及时的将芯片产生的热量传导出去,会导致其性能下降,寿命缩短,甚至造成永久性破坏。设计的紫外LED水冷板散热模型,首先通过计算得出芯片温度的理论结果,再应用Fluent软件模拟分析水冷板芯片的温度场、板面温度和压降等重要参数,最后计算和仿真结果相互验证。结果表明:该水冷板模型设计合理,能够满足半导体芯片的降温要求,并且保证了芯片内部温度的均匀性,有利于半导体器件高效稳定的运行。With the increase of the power and the decrease of the volume of the semiconductor devices, heat dissipation of semiconductor chip has become an important factor to restrict its reliability and stability, if the heat generated by the chip can not be conducted away, it will make the performance decline, life shorten, and even cause permanent damage. The cooling plate model of UV-LED /s presented, the theoretical results of chip temperature are calculated, and then the important parameters of temperature field, surface temperature and pressure drop are analyzed by simulation software Fluent, finally the results of calculation and simulation are verified by each other. It shows that the design of the water cooling plate model is reasonable, which can meet the cooling requirements, ensure the uniformity of the internal temperature of the chip, and it is conducive to the efficient and stable operation of semiconductor device.

关 键 词：设计 模型 水冷板 数值模拟 优化 

分 类 号：TH16[机械工程—机械制造及自动化]