厚铜电路板的翘曲影响因素分析与改善  

Analysis and improvement of warping factors of thick copper circuit board

作　　者：管术春 蓝春华 张鸿伟 谭小林 

机构地区：[1]江西景旺精密电路有限公司,江西吉安331608 [2]景旺电子科技(龙川)有限公司,广东河源517373 [3]广东省金属基印制电路板工程技术研究开发中心,广东河源517373

出　　处：《印制电路信息》2018年第1期37-40,共4页Printed Circuit Information

摘　　要：PCB的板件平整度对电子元器件表面贴装至关重要。PCB的叠层结构、图形线路设计、制造工艺等影响因素,如设计不合理,都会导致不同程度的板翘。本文通过对厚铜PCB的翘曲问题案例分析,研究与实验厚铜PCB的翘曲影响因素并提出改善方向。The flatness of the PCB is very important to the electronic components in SMT process. The stack-up, pattern design, manufacturing technology and other factors will also lead to different levels of warpage, if design is unreasonable. Through the analysis of heavy copper PCB warping problem case, this article studies and tests the affecting factors of the heavy copper PCB warpage problem, also comes up with improvementdirection.

关 键 词：厚铜印制电路板 板翘 翘曲度 叠层结构 

分 类 号：TN41[电子电信—微电子学与固体电子学]