树脂薄片砂轮专利技术综述  

作　　者：张叠 石琪琦 

机构地区：[1]国家知识产权局专利局专利审查协作四川中心,四川成都610000

出　　处：《科技创新与应用》2018年第4期5-6,共2页Technology Innovation and Application

摘　　要：树脂薄片砂轮是以树脂为粘接剂,将松散的磨料粘结起来,固结呈一定厚度的薄片砂轮,其在半导体、航空航天等精磨切磨加工领域有着广泛应用。文章针对磨料薄片砂轮技术相关专利进行了分析。Resin wafer grinding wheel is a kind of thin abrasive wheel, which solidiiies loose abrasive materials to a degree of thickness. It is widely used in semiconductor, aerospace and other fields of fine grinding and cutting grinding. In this paper, the patent of abrasive wafer grinding wheel is analyzed.

关 键 词：薄片砂轮 树脂 专利 

分 类 号：T-18[一般工业技术]