Role of late transition metals on pitting resistance of Zr-Ti-(Cu, Ni,Co)-Al bulk metallic glasses in 0.6 M NaCl aqueous solution  

作　　者：Yu Li Jian Xu 

机构地区：[1]Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences [2]Graduate School, University of Chinese Academy of Sciences

出　　处：《Journal of Materials Science & Technology》2017年第11期1278-1288,共11页材料科学技术（英文版）

基　　金：supported by the National Natural Science Foundation of China under Grant No. 51571192

摘　　要：Four quanternary Zr-based bulk metallic glasses（BMGs）were selected,including the Zr_（46）Ti_2Cu_（45）Al_7,Zr_（61）Ti_2Cu_（25）Al_（12）,Zr_（55）Ti_4Ni_（22）Al_（19）and Zr_（55）Ti_2Co_（28）Al_（15）,due to their robust glass-forming ability and containing a single species of late transition metal（LTM）in compositions.Their pitting resistances in 0.6 M Na Cl aqueous solution were investigated to examine the role of LTM elements in the alloys,with electrochemical measurements,surface morphology observation and x-ray photoelectron spectrometry analysis.It is shown that in comparision with two Cu-bearing BMGs,Zr_（55）Ti_4Ni_（22）Al_（19）and Zr_（55）Ti_2Co_（28）Al_（15）BMGs exhibited significantly superior resistance to pitting.Zr_（61）Ti_2Cu_（25）Al_（12）,Zr_（55）Ti_4Ni_（22）Al_（19）and Zr_（55）Ti_2Co_（28）Al_（15）BMGs manifested distinct passivation behaviour,because of the formation of surface passive film mainly comprising of Zr O_2,Ti O_2and Al_2O_3.However,no significant differences in the electrochemical resistive properties and thicknesses of passive films were found between Zr_（61）Ti_2Cu_（25）Al_（12）and Zr_（55）Ti_4Ni_（22）Al_（19）BMGs.Nevertheless,at the passive film/metal interface,copper enrichment took place in Zr_（61）Ti_2Cu_（25）Al_（12）,whereas the nickel was slightly deficient at the interface in Zr_（55）Ti_4Ni_（22）Al_（19）.During pitting propagation,selective dissolution of the zirconium,titanium and aluminum over the copper took place in Zr_（61）Ti_2Cu_（25）Al_（12）,but it was not the case in Zr_（55）Ti_4Ni_（22）Al_（19）.For the two Cu-bearing BMGs,reduction of passive base metal elements in composition resulted in local selective dissolution,even absence of the passivation.Four quanternary Zr-based bulk metallic glasses（BMGs）were selected,including the Zr_（46）Ti_2Cu_（45）Al_7,Zr_（61）Ti_2Cu_（25）Al_（12）,Zr_（55）Ti_4Ni_（22）Al_（19）and Zr_（55）Ti_2Co_（28）Al_（15）,due to their robust glass-forming ability and containing a single species of late transition metal（LTM）in compositions.Their pitting resistances in 0.6 M Na Cl aqueous solution were investigated to examine the role of LTM elements in the alloys,with electrochemical measurements,surface morphology observation and x-ray photoelectron spectrometry analysis.It is shown that in comparision with two Cu-bearing BMGs,Zr_（55）Ti_4Ni_（22）Al_（19）and Zr_（55）Ti_2Co_（28）Al_（15）BMGs exhibited significantly superior resistance to pitting.Zr_（61）Ti_2Cu_（25）Al_（12）,Zr_（55）Ti_4Ni_（22）Al_（19）and Zr_（55）Ti_2Co_（28）Al_（15）BMGs manifested distinct passivation behaviour,because of the formation of surface passive film mainly comprising of Zr O_2,Ti O_2and Al_2O_3.However,no significant differences in the electrochemical resistive properties and thicknesses of passive films were found between Zr_（61）Ti_2Cu_（25）Al_（12）and Zr_（55）Ti_4Ni_（22）Al_（19）BMGs.Nevertheless,at the passive film/metal interface,copper enrichment took place in Zr_（61）Ti_2Cu_（25）Al_（12）,whereas the nickel was slightly deficient at the interface in Zr_（55）Ti_4Ni_（22）Al_（19）.During pitting propagation,selective dissolution of the zirconium,titanium and aluminum over the copper took place in Zr_（61）Ti_2Cu_（25）Al_（12）,but it was not the case in Zr_（55）Ti_4Ni_（22）Al_（19）.For the two Cu-bearing BMGs,reduction of passive base metal elements in composition resulted in local selective dissolution,even absence of the passivation.

关 键 词：Bulk metallic glass Pitting corrosion Electrochemical behavior Passive film 

分 类 号：TG174.4[金属学及工艺—金属表面处理]