溅射靶材绑定用Sn-Zn-In-Bi-Al焊料合金的组织与性能  

Microstructure and Properties of Sn-Zn-In-Bi-Al Solder Alloy for Sputtering Target Bonding

作　　者：燕翙江 张建新[1] 卜丽静[1] 朱朝刚 杨勇[1] 褚振华[1] 董艳春[1] 何继宁[1] 刘娜 

机构地区：[1]河北工业大学材料科学与工程学院,天津300132 [2]风帆有限责任公司,保定071051

出　　处：《机械工程材料》2018年第1期64-67,71,共5页Materials For Mechanical Engineering

摘　　要：采用微合金化方法制备了Sn-7.0Zn-xIn-3.8Bi-0.2Al(x=0,4.5,5.0,5.5)4种焊料合金,研究了铟含量对焊料合金显微组织、熔点、润湿性、导电性、导热性等的影响,并与传统纯铟、纯锡焊料进行了对比。结果表明:焊料合金主要由β-锡相和富锌相组成;随着铟含量的升高,合金的熔点逐渐降低,润湿性、导电性、导热性逐渐增强;Sn-7.0Zn-5.0In-3.8Bi-0.2Al合金的熔点、润湿性均优于纯锡焊料的,且接近纯铟焊料的,电阻率、热导率均接近纯锡焊料的,该焊料合金为合适的溅射靶材绑定用焊料合金。Four solder alloys of Sn-7.0Zn-xIn-3.8Bi-0.2Al（x=0,4.5,5.0,5.5）were prepared by microalloying method.The influence of the In content on the microstructure,melting point,wettability,electrical conductivity,thermal conductivity of the solder alloys were studied,and compared with the performance of traditional pure In and Sn solders.The results show that the solder alloys consisted essentially ofβ-Sn and Zn-rich phases.The melting point of the solder alloys gradually decreased and the wettability,electrical conductivity,thermal conductivity increased with the increase of In content.The melting point and wettability of Sn-7.0Zn-5.0In-3.8Bi-0.2Al solder alloy were better than those of pure Sn solder and close to those of of pure In solder.The resistivity and thermal conductivity of the solder alloy were close to those of of pure Sn solder.It was confirmed that Sn-7.0Zn-5.0In-3.8Bi-0.2Al solder alloy was suitable for sputtering target bonding.

关 键 词：Sn-Zn-In-Bi-Al焊料合金 靶材绑定 显微组织 润湿性 熔点 

分 类 号：TG425[金属学及工艺—焊接]