功率型LED封装胶的制备与研究功率型LED封装胶的制备与研究  

Study on the Preparation and Research of LED Encapsulation

作　　者：文铭孝 邱美坚 冯璐 栾安博 黄奇然 

机构地区：[1]广东省石油与精细化工研究院广东省化学工业公共实验室,广东广州510665

出　　处：《广东化工》2018年第4期1-2,共2页Guangdong Chemical Industry

摘　　要：通过自主合成的甲基苯基乙烯基硅油、甲基苯基含氢硅油和补强剂,并优化组合,制备了一种高性能高折射率LED封装胶,讨论了催化剂、补强剂配比及固化条件对封装胶性能的影响。所制备的封装胶热稳定性高,通过TG分析,产品在300℃下稳定,5%的失重可达到430℃;其力学和光学性能优异,拉伸强度可达1.5 MPa,透光率为98%、折光率为1.54。该产品可广泛用于高折光、功率型光学器件的封装和涂层材料等领域。In this paper, the methyl phenyl vinyl silicone resin, methyl phenyl hydrogen silicone resin and reinforcing agent were synthesized by self, and a high performance and high refractive index LED encapsulation was prepared. The product has a high decomposition temperature, can be widely used in the fields of packaging and coating materials of high refraction and power optical devices.

关 键 词：LED封装胶 补强剂 力学性能 

分 类 号：TN312.8[电子电信—物理电子学] TQ436[化学工程]