BPDA/ODA/PDA型PI薄膜的制备及性能研究  

Preparation and Properties of BPDA/ODA/PDA PI Films

作　　者：韩松锋 唐必连[2] 马传国[1] 青双桂[2] 汪英[2] 

机构地区：[1]桂林电子科技大学材料科学与工程学院,广西桂林541004 [2]桂林电器科学研究院有限公司,广西桂林541004

出　　处：《绝缘材料》2018年第1期17-21,共5页Insulating Materials

基　　金：国家自然科学基金资助项目(51363003);桂林市科学研究与技术开发计划项目(2016010705);桂林电子科技大学研究生教育创新计划资助项目(2017YJCX121)

摘　　要：在3,3′,4,4′-联苯四甲酸二酐(s-BPDA)和4,4′-二氨基二苯醚(ODA)分子结构中引入刚性对苯二胺(PDA),通过无规共聚法制备聚酰亚胺(PI)薄膜,采用XRD、TMA、DMA、TGA和万能试验机对薄膜聚集态结构及物理性能进行表征。结果表明:PDA单体的引入可显著降低PI薄膜的热膨胀系数,提高拉伸强度、弹性模量、玻璃化转变温度和热分解温度。其中,随着刚性PDA单体含量的增加,该系列PI薄膜的拉伸强度、弹性模量、玻璃化转变温度和热分解温度呈递增趋势,热膨胀系数和断裂伸长率呈递减趋势。通过调控不同二胺单体的比例可以达到分子结构设计的目的,进而制备出热膨胀系数等多项物理参数可调的联苯型PI薄膜。A series of polyimide （PI） films were prepared via random copolymerization by introducing rigid p-phenylenediamine （PDA） monomer into 3,3＇,4,4＇-biphenyltetracarboxylic acid dianhydride/ 4,4＇-diaminodiphenyl ether （s-BPDA/ODA） molecular chain. Their aggregation structure and physical properties were characterized via XRD, TMA, DMA, TGA, and universal testing machine. The results show that the introduction of PDA monomer significantly reduces the thermal expansion coefficient and increases the tensile strength, elastic modulus, glass transition temperature, and thermal decomposition temperature of the PI films. With the increase of rigid PDA monomer content, the tensile strength, elastic modulus, glass transition temperature, and thermal decomposition temperature of the PI films increase, while the thermal expansion coefficient and elongation at break decrease. The results indicate that the biphenyl PI films with various adjustable physical parameters such as thermal expansion coefficient can be prepared via regulating the ratio of different diamine monomers.

关 键 词：对苯二胺 无规共聚 聚酰亚胺薄膜 热膨胀系数 

分 类 号：TM215.3[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]