单晶硅线切割液润滑性能的研究  

Friction properties of water-based cutting fluid for crystal wafer cutting

作　　者：宋扬扬[1] 张晨晖[1] 张瑞[1] 吴珉[1] 刘军[1] 

机构地区：[1]陕西省石油化工研究设计院,陕西西安710054

出　　处：《化学工程师》2018年第1期65-67,共3页Chemical Engineer

基　　金：陕西省科技统筹项目(No.2016KTZDGY09-09)

摘　　要：重点研究了单晶硅片切割用水基切割液中润滑剂的摩擦性能影响因素。研究了不同种类水基润滑剂的摩擦学性能。结果表明:在使用自制植物油改性润滑剂,使用浓度为万分之七的情况下,具备优异的润滑性能。UInfluence factors of the friction performance of the lubricating agent in the water-based cutting flu- id for crystal wafer cutting were mainly studied.We analysized the different types of water-based lubricants used as the lubricants. The results showed that the solution with 0.07% vegetable oil modified lubricant showed the best lu- brication.

关 键 词：切割液 润滑性能 线切割 植物油改性润滑剂 

分 类 号：TQ164[化学工程—高温制品工业]