无氰脉冲电镀金-铜合金工艺的研究  

Study on Cyanide-Free Pulse Electroplating Process for Au-Cu Alloy

作　　者：孙博宇[1] 郭东明[1] 安润莉 王宇[1] 金洙吉[1] 姜冠楠[1] 

机构地区：[1]大连理工大学现代制造研究所,辽宁大连116024

出　　处：《电镀与环保》2018年第1期8-12,共5页Electroplating & Pollution Control

摘　　要：研究了一种以亚硫酸钠-HEDP为主配位剂的无氰脉冲电镀金-铜合金工艺。通过单因素试验考察了镀层表面形貌和沉积速率,并得出电流密度、镀液pH值、镀液温度和搅拌速率的影响规律及一组优选电镀工艺参数:电流密度0.3A/dm^2,镀液pH值9.0,镀液温度60℃,搅拌速率1 000r/min。另外,评价了镀层和镀液的各方面性能。结果表明:镀层仅含金、铜元素;镀层表面细致均匀,孔隙率低,平整性好,无裂纹;镀层硬度高,结合力好,耐蚀性强;电流效率高,镀液稳定性好。A cyanide-free pulse electroplating process for Au-Cu alloy using sodium sulfite and HEDP as complexing agent was investigated. The surface morphology of coating and the deposition rate were investigated through single factor experiment. The influence law of current density, plating bath pH value, plating bath temperature and stirring speed was obtained, and a set of optimal electroplating parameters were determined as follows： current density 0.3 A/dm2 , pH value 9. 0, temperature 60 ℃, stirring speed 1 000 r/min. Besides, the performances of coating and plating bath were evaluated. Results showed that there are only Au and Cu element in the coating, and the coating has fine and uniform grains, low porosity, good smoothness and free of cracks, with high hardness, excellent adhesion and corrosion resistance. The plating bath has high current efficiency and good stability.

关 键 词：无氰脉冲电镀 表面形貌 沉积速率 工艺参数 

分 类 号：TQ153[化学工程—电化学工业]