超疏水性铜表面处理技术的研究  

Study on Fabrication of Super-hydrophobic Surface on Copper Substrate

作　　者：王学江 杨祥魁 徐树民 王维河 薛伟 徐好强 

机构地区：[1]山东金宝电子股份有限公司,山东招远265400

出　　处：《电镀与环保》2018年第1期19-22,共4页Electroplating & Pollution Control

摘　　要：在电解法制备的低轮廓铜箔表面,采用一种特殊的表面处理工艺和粗化添加剂制备出具有类似荷叶表面微观结构的铜表面。铜表面的超疏水效果良好,静态接触角达到153.6°。该制备方法以目前的电解铜箔生产线为基础,具有操作简单、控制容易、成本较低、条件温和等优点,非常适合连续化生产。该方法可推动超疏水性铜在实际生产中的广泛应用。A lotus-leaf-like super-hydrophobic surface on the low profile copper foil was fabricated by means of a unique surface treatment technology and with coarsening additive. The copper surface showed good super-hydrophobie effect, and the static contact angle reached 153.6 °. This method was based on the current electrolysis copper foil product line, and it has the advantages of simple to operate, easy control, lower cost, mild conditions and very suitable for continuous production. This method can promote the super-hydrophobic surface on copper foil to be widely used in practical production.

关 键 词：超疏水表面 酸性镀铜 表面处理 荷叶结构 接触角 

分 类 号：TG146[一般工业技术—材料科学与工程]