稳定剂对中温化学镀镍–磷合金的影响  

Effects of stabilizers on electroless plating of nickel–phosphorus alloy at moderate temperature

作　　者：叶涛 刘定富[1] 沈岳军 

机构地区：[1]贵州大学化学与化工学院,贵州贵阳550025

出　　处：《电镀与涂饰》2018年第1期9-12,共4页Electroplating & Finishing

基　　金：2017年贵州大学研究生创新基金(研理工2017003);铝合金化学镀镍低铬钝化综合研究(黔科合区域合[2014]7007)

摘　　要：以镀液稳定性、沉积速率、镀层磷含量和光泽度为评价指标,研究了硫酸铜、硫酸高铈和硫脲各自作为稳定剂时对45钢上中温化学镀镍的影响。镀液的基础配方和工艺条件为:NaH_2PO_2·H_2O 28 g/L,Ni SO4·6H_2O 26 g/L,C_6H_8O_7·H_2O 12 g/L,CH_3COONa·3H_2O 15 g/L,十二烷基磺酸钠(SDS)10 mg/L,丁二酸3 g/L,pH 5.2±0.2,温度(75±2)°C,时间1 h。采用硫酸铜作为稳定剂时,镀层的光泽度最好,但沉积速率较慢;采用硫脲作为稳定剂时,镀液稳定性最好,沉积速率最快,但镀层光泽度较低;采用硫酸高铈作为稳定剂时,化学镀镍的效果不佳。将6 mg/L CuSO_4·5H_2O与2 mg/L硫脲复配时,镀液稳定性最好,沉积速率为15.72μm/h,可获得光泽度为171.3 Gs、表面平滑、结晶细致的中磷化学镀镍层。The effects of copper sulfate, cerium（IV） sulfate and thiourea respectively as a stabilizer on electroless nickel plating at moderate temperature were studied by evaluating the bath stability, deposition rate, phosphorus content and glossiness of nickel coating. The basic bath composition and process conditions are as follows： NaH2PO2·H2O 28 g/L, NiSO4·6H2O 26 g/L, C6H8O7·H2O 12 g/L, CH3COONa·3H2O 15 g/L, sodium dodecyl sulfonate （SDS）10 mg/L, succinic acid 3 g/L, temperature （75 ± 2） ℃, pH 5.2 ± 0.2, and time 1 h. The bath containing copper sulfate produces nickel coatings with the highest glossiness at a slow deposition rate. When using thiourea, both bath stability and deposition rate are the best, but the glossiness of nickel coating is low. The result of electroless nickel plating with cerium（IV） sulfate as stabilizer is not satisfactory. When 6 mg/L CuSO4·5H2O and 2 mg/L thiourea are combined, the bath has the best stability with a deposition rate of 15.72 μm, and produces medium-phosphorus-content nickel coating with a glossiness of 171.3 Gs, smooth surface, as well as fine and compact crystallization.

关 键 词：碳钢 化学镀镍 中温 稳定剂 硫酸铜 硫酸高铈 硫脲 光泽度 

分 类 号：TQ153.2[化学工程—电化学工业]