55%SiCp/6061Al复合材料与PbO-ZnO-B_2O_3玻璃封接机理研究  

Sealing Mechanism of Interface between 55%SiCp/6061 Al Composite Materials and PbO-ZnO-B_2O_3 Glass

作　　者：许磊[1] 陈志茹 历长云[1] 王有超[1] 米国发[1] 

机构地区：[1]河南理工大学,河南焦作454000

出　　处：《稀有金属材料与工程》2018年第1期169-174,共6页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51401077)

摘　　要：主要研究了55%SiCp/Al复合材料与PbO-ZnO-B_2O_3玻璃封接过程中的润湿性和界面结合机理。研究结果显示:随温度升高,玻璃在4种母材上的铺展面积逐渐变大,润湿角减小,润湿能力提高,Al_2O_3陶瓷和SiC陶瓷与玻璃封接的铺展面积较大,润湿角较小,润湿性要优于复合材料。在450~490℃范围内将玻璃与55%SiCp/6061Al进行封接时,当封接温度高于470℃,在封接界面出现气泡,且随着温度升高气泡数量增多,尺寸变大;在460℃下封接时,玻璃与55%SiC/Al复合材料封接界面存在约为12μm的元素互渗区域,490℃时玻璃与Al_2O_3陶瓷的界面分界线清晰,与SiC陶瓷封接界面处,偏向玻璃侧存在SiC颗粒的渗入。The wettability and interface bonding mechanism between 55% SiCp/6061A1 composite materials and PbO-ZnO-B203 glass during the sealing process were investigated. The results show that the glass would spread wider with the increase of temperatures. The wettability angle becomes smaller and the wettability is improved. The spreading area of glass on A1203 and SiC is larger and the wettability angles are smaller than those on the composites. The sealing temperature between glasses and 55% SiCp/6061A1 ranges from 450-490 ℃. When the sealing temperature is higher than 470 ℃, bubbles would appear in the sealing interface and the number of bubbles increases with the increasing of temperatures; at the same time the size of the bubbles becomes larger too. When the sealing temperature is 460 ℃, a 12 μm diffusion region appears between the glass and 55% SiC/A1 composites. When the sealing temperature is 490 ℃, there is a clear boundary between the glass and A1203 ceramic, and the SiC particles would diffuse into the glass when the glass and SiC ceramic are sealed together.

关 键 词：55%SiCp/Al复合材料 PbO-ZnO-B2O3玻璃 封接 润湿性 界面结合 

分 类 号：TQ171[化学工程—玻璃工业]