Single-chip 3D electric field microsensor  

作　　者：Biyun LING Yu WANG Chunrong PENG Bing LI Zhaozhi CHU Bin LI Shanhong XIA 

机构地区：[1]State Key Laboratory of Transducer Technology, Institute of Electronics,Chinese Academy of Sciences, Beijing 100190, China [2]University of Chinese Academy of Sciences, Beijing 100049, China

出　　处：《Frontiers of Mechanical Engineering》2017年第4期581-590,共10页机械工程前沿（英文版）

摘　　要：This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0-50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measure- ment errors of the three electrostatic field components are less than 14.04%.This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0-50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measure- ment errors of the three electrostatic field components are less than 14.04%.

关 键 词：electric field microsensor three-dimensional single-chip in-plane rotation 

分 类 号：TP391.41[自动化与计算机技术—计算机应用技术] TN304.23[自动化与计算机技术—计算机科学与技术]