板片状Al_2O_3磨料对碲锌镉晶体机械研磨的影响  

Effect of Plate-like Al_2O_3 Abrasives on Mechanical Lapping of CdZnTe Crystals

作　　者：毛晓辰 朱丽慧[1] 虞慧娴[2] 周昌鹤[2] 孙士文[2] 陈燕 

机构地区：[1]上海大学材料科学与工程学院,上海200072 [2]中国科学院红外成像材料与器件重点实验室,上海200083 [3]中国铝业郑州有色金属研究院有限公司,郑州450041

出　　处：《人工晶体学报》2018年第2期261-266,共6页Journal of Synthetic Crystals

基　　金：红外成像与器件重点实验室开放基金

摘　　要：采用具有不同形状特征的Al_2O_3磨料对CdZnTe晶片进行机械研磨,研究了磨粒形状、粒径对晶片的去除速率、研磨后晶片表面形貌的影响,并讨论了其影响机理。研究表明,多角形不规则磨粒易在晶片表面产生划痕,且易在磨盘与晶片之间发生滚动,导致去除速率下降。板片状磨粒因不易发生滚动,易形成二体磨粒以边缘凿削晶片表面的方式去除。棱角度较高的薄板片状磨粒有利于CZT晶片的机械研磨,且去除速率随粒径增大而增大,但当粒径较大时易形成深凹坑。表面圆润平滑的厚板片状磨粒对去除速率不利。粒径(D50)为3.34μm的薄板片状磨料既能得到较高的去除速率,也能保证研磨后晶片表面波纹度Wa值和凹坑面积占比较低,晶片表面质量好。Al2O3 abrasives with different shapes were used for the mechanical lapping of CdZnTe crystals. The effect and influence mechanism of particle shape and particle size on the removal rate and morphology of the lapped wafer surfaces were investigated. Research shows that the polygonal abrasives with irregular shape are prone to generate scratches on the wafer surface, and they are easy to scroll between the grinding disc and the wafer surface, resulting in the decrease of removal rate. The plate-like abrasives are prone to become two-body type abrasive since they are difficult to scroll. Thus, the wafer surfaces are gouged through the edges of plate-like abrasives. The thin plate-like abrasives with clear edges are beneficial to the mechanical lapping of CdZnTe, and the removal rate increases with the increase of particle size. However, it is easy to generate deep pits when the abrasives with big size are used. By contrast, the plate-like abrasives which are round and smooth are disadvantageous to the removal rate. Improved removal rate and surface qualities can be obtained by the thin plate-like Al2O3 abrasives with D50 of 3.34 μm, including low waviness value （Wa） and pit area ratio.

关 键 词：CDZNTE晶体 机械研磨 板片状Al2O3磨料 去除机理 

分 类 号：TG356.28[金属学及工艺—金属压力加工]