Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections  

作　　者：Bin Zhang Xiaokuo Yang Jiahao Liu Weiwei Li Jie Xu 

机构地区：[1]Department of Foundation, Air Force Engineering University [2]Tsinghua National Laboratory for Information Science and Technology, Institute of Microelectronics, Tsinghua University

出　　处：《Journal of Semiconductors》2018年第2期45-50,共6页半导体学报（英文版）

基　　金：supported by the National Natural Science Foundation of China(No.61302022);the Scientific Research Foundation for Postdoctor of Air Force Engineering University(Nos.2015BSKYQD03,2016KYMZ06)

摘　　要：Nanomagnet logic（NML） devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentially low power. In this article, errors of nanomagnetic interconnect wire subjected to magnet edge imperfections have been evaluated for the purpose of reliable logic propagation. The missing corner defects of nanomagnet in the wire are modeled with a triangle, and the interconnect fabricated with various magnetic materials is thoroughly investigated by micromagnetic simulations under different corner defect amplitudes and device spacings. The results show that as the defect amplitude increases, the success rate of logic propagation in the interconnect decreases. More results show that from the interconnect wire fabricated with materials, iron demonstrates the best defect tolerance ability among three representative and frequently used NML materials, also logic transmission errors can be mitigated by adjusting spacing between nanomagnets. These findings can provide key technical guides for designing reliable interconnects.Nanomagnet logic（NML） devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentially low power. In this article, errors of nanomagnetic interconnect wire subjected to magnet edge imperfections have been evaluated for the purpose of reliable logic propagation. The missing corner defects of nanomagnet in the wire are modeled with a triangle, and the interconnect fabricated with various magnetic materials is thoroughly investigated by micromagnetic simulations under different corner defect amplitudes and device spacings. The results show that as the defect amplitude increases, the success rate of logic propagation in the interconnect decreases. More results show that from the interconnect wire fabricated with materials, iron demonstrates the best defect tolerance ability among three representative and frequently used NML materials, also logic transmission errors can be mitigated by adjusting spacing between nanomagnets. These findings can provide key technical guides for designing reliable interconnects.

关 键 词：nanomagnet logic device defect interconnect reliability 

分 类 号：TN386[电子电信—物理电子学]