Binding property of Al/Mg/Al thin plates fabricated by one-pass hot rolling with different reduction ratios,temperatures and annealing treatments  

作　　者：Ai-Li Wei Xing-Hai Liu Li Dong Wei Liang 

机构地区：[1]School of Materials Science and Engineering, Taiyuan University of Technology

出　　处：《Rare Metals》2018年第2期136-142,共7页稀有金属（英文版）

基　　金：financially supported by the National Natural Science Foundation of China (Nos.51301118 and 51175363);the Specialized Research Fund for the Doctoral Program of Higher Education (No.20050112001);the Natural Science Foundation of Shanxi Province (No. 2006011051)

摘　　要：In this study, Al-Mg-Al trilaminated thin plates were fabricated by one-pass hot rolling to improve the processing capacity and bonding strength of magne- sium alloy plates. The effects of processing parameters were investigated. The results show that the optimal bonding strength is up to 20 MPa with a reduction ratio of 40 % and rolling temperature of 400 ℃, superior than that in other one-pass rolling studies with regard to thin lami- nated plates. In addition, a favorable property is achieved with the annealing temperature of 250-300 ℃ or annealing time of 1.5 h. When the annealing temperature exceeds 300 ℃ or annealing time exceeds 1.5 h, respectively, the bonding strength of Al/Mg/Al plate decreases. The scan- ning electron microscopy （SEM） and energy-dispersive spectroscopy （EDS） analyses suggest that the appearance of thin diffusion layers between Al and Mg interfaces is helpful to improve the bonding strength, while the presence of thick diffusion layer would reduce the bonding strength greatly.In this study, Al-Mg-Al trilaminated thin plates were fabricated by one-pass hot rolling to improve the processing capacity and bonding strength of magne- sium alloy plates. The effects of processing parameters were investigated. The results show that the optimal bonding strength is up to 20 MPa with a reduction ratio of 40 % and rolling temperature of 400 ℃, superior than that in other one-pass rolling studies with regard to thin lami- nated plates. In addition, a favorable property is achieved with the annealing temperature of 250-300 ℃ or annealing time of 1.5 h. When the annealing temperature exceeds 300 ℃ or annealing time exceeds 1.5 h, respectively, the bonding strength of Al/Mg/Al plate decreases. The scan- ning electron microscopy （SEM） and energy-dispersive spectroscopy （EDS） analyses suggest that the appearance of thin diffusion layers between Al and Mg interfaces is helpful to improve the bonding strength, while the presence of thick diffusion layer would reduce the bonding strength greatly.

关 键 词：Al-Mg-Al thin plates One-pass rolling Bonding strength MESOPHASE Microstructure 

分 类 号：TG156.2[金属学及工艺—热处理] TG335.5[金属学及工艺—金属学]