下一代超薄型光盘半片的注塑——TCM技术  

Molding process of next generation super thin half substrate-TCM technology

作　　者：陈厚模 

机构地区：[1]福茂工程(香港)有限公司

出　　处：《记录媒体技术》2006年第Z1期46-48,共3页China Mediatech

摘　　要：本文就最新的超薄型光盘半片射出成型的要求, 来简介三种薄型器件注塑模具设计的改进原理,并且探讨有关主动式“热循环注塑”(TCM)运用的可能。Molding technology has been evolved with new materials and an innovated heating-cooling method known as Thermal Cyclic Molding (TCM). This paper gives a preview of the TCM technology and all other related methods to achieve the molding for substrates with a thickness less than 0.6mm.

关 键 词：超薄型 TCM 注塑模具设计 模温 锁模力 冷却水道 热循环 盘基 发光管 注塑成型 

分 类 号：TQ596[化学工程—精细化工]