工艺参数及稳定剂抗坏血酸对电沉积NiFeW合金镀层的影响（英文）  

Effect of Processing Parameters and Ascorbic Acid on the Electrodeposition NiFeW Alloy Coatings

作　　者：于金库[1] 赵莉莉 孙会 王跃华 于美琪 骆洪亮 许哲峰 松木一弘 

机构地区：[1]燕山大学亚稳材料制备技术与科学国家重点实验室,河北秦皇岛066004 [2]広島大学工学研究院

出　　处：《稀有金属材料与工程》2018年第2期436-441,共6页Rare Metal Materials and Engineering

基　　金：the Colleges and Universities of Science and Technology Research Projects of Hebei Province in China(ZD2014055)

摘　　要：为获得性能良好的镍铁钨合金镀层,研究了镀液pH值、温度、电流密度、稳定剂抗坏血酸浓度对镍铁钨合金镀层成分和镀层沉积速率、显微硬度的影响。结果表明:镀液pH值对镀层W含量和镀层沉积速率影响较大;镀液温度对镀层沉积速率、镀层成分和镀层硬度影响均较大;随抗坏血酸浓度增加,镀层沉积速率逐渐降低,镀层表面形貌更加粗糙。在镀液pH=4,温度60℃,电流密度4A/dm^2,抗坏血酸浓度3 g/L时,镀层沉积速率和镀层的显微硬度较高,表面光亮致密,耐蚀性好。In order to obtain Ni FeW alloy coating with good performance, we studied the influence of p H value, temperature, current density, and the concentration of ascorbic acid stabilizer on the composition, deposition rate, and microhardness of NiF eW alloy coating. The results show that the pH value of plating bath largely influences the concentration of W and the deposition rate of the coating; the temperature of plating bath greatly affects the deposition rate, composition, and microhardness of the coating; upon increasing the concentration of ascorbic acid, the deposition rate of the coating decreases whereas the surface morphology of coating becomes more rough. With the pH value of plating bath equal to 4, temperature of 60 ℃, current density of 4 A/dm^2, and ascorbic-acid concentration of 3 g/L, the deposition rate and the hardness of the coating are high. In addition, both the surface quality and the corrosion resistance of the coating are good.

关 键 词：镍铁钨合金镀层 电沉积 显微硬度 耐蚀性 

分 类 号：TG174.44[金属学及工艺—金属表面处理]