高导热金属基板材料及金属基印制板的技术发展现况与分析  

Present situation and analysis of technology development of high thermal conductivity metal substrate materials and metal based PCB

作　　者：柯勇 陈毅龙 谭小林 王远 KE Yong, CHENG Yi-long, TAN Xiao-lin, WANG Yuan

机构地区：[1]景旺电子科技(龙川)有限公司,广东河源517373

出　　处：《印制电路信息》2018年第3期23-33,共11页Printed Circuit Information

基　　金：2016年广东省应用型科技研发专项资金项目(项目编号:2016B090930004)资助

摘　　要：金属基印制板具有高导热性、高耐热性、高散热性、高绝缘性等综合性能优异,是目前用途最广、用量最大的一种散热印制板。笔者对近六年的行业核心期刊和专题论文集收集、查阅、分析以及检索中国发明专利申请和公布情况,加以综合分析和概述国内外高导热金属基板材料和金属基印制板的技术发展现状,并比较国内同类技术与国外技术的差距,最后探讨国内企业如何发展高散热金属基印制板市场。Metal based PCB with high thermal conductivity, high heat resistance, high heat dissipation, high insulation and other comprehensive performance is excellent, and is the most widely used, the largest amount of using as a cooling substrate. The author summarizes the technological development of high thermal conductivity metal substrate materials and metal based PCB at home and abroad, and collects, inspects and analyzes the application and publication of patent applications and announcements of Chinese invention in the past six years. It introduces the domestic similar technology and foreign technology gap, and finally explores how domestic enterprises develop high heat metal based PCB market.

关 键 词：高导热金属基覆铜板 铝基覆铜板 散热印制板 金属基印制板 

分 类 号：TN41[电子电信—微电子学与固体电子学]