微孔纳米板与陶瓷纤维板热导率对比研究  

Comparison of Thermal Conductivity Between Microporous Nano Plate and Fiber Board

作　　者：雒彩云[1] 杨莉萍[1] 陶冶[1] 徐子君[1] 钟秋[1] LUO Caiyun ,YANG Liping ,TAO Ye ,XU Zijun ,ZHONG Qiu(Shanghai Institute of Ceramics, Chinese Academy of Science,Shanghai 20005)

机构地区：[1]中国科学院上海硅酸盐研究所无机材料分析测试中心,上海200050

出　　处：《宇航材料工艺》2017年第6期69-72,共4页Aerospace Materials & Technology

基　　金：国家重点研发计划重大仪器设备开发专项"宽幅变温磁环境差式扫描量热仪工程化及应用开发"(2016YFF0101701);载人航天工程资助项目(TGJZ800-2-RW024)

摘　　要：文摘采用非稳态热线法测试了微孔纳米板与陶瓷纤维板在RT^1 000℃区间热导率,利用SEM微观形貌与荧光光谱成分分析,结合微观导热机理对测试结果进行了分析。结果表明:纳米板热导率分布在0.03~0.1 W/(m·K)区间,纤维板为0.055~0.25 W/(m·K);两种材料热导率均随着温度升高而增大,且规律均为先缓后急,不同的是,纤维板热导率在300℃以后开始急剧增大,而纳米板在550℃之后才开始较快增长;纳米板整体上升趋势缓于纤维板,温度越高,两者热导率差异越大。分析认为纳米尺寸的固体颗粒及内部气孔是纳米板拥有低热导率的关键因素。The thermal conductivity of microporous wire method at RT to 1000℃ temperature range, and the nano plate and fiber board was measured by non steady hot- results were analyzed and explained by SEM micro morpholo- gy analysis and fluorescence spectrum composition analysis, combined with micro thermal conductivity mechanism.The results show that the thermal conductivity of the nano plate is in the range of 0.03 to 0.1W/（m·K）, and the fiber board is 0.055 to 0.25W/（m-K） ,the thermal conductivity of the two materials both have an upward trend with in- creasing temperature, the difference is that the thermal conductivity of fiber board began to increase sharply after 300℃, while the nano plate started after 550℃ .However, the overall trend of the nano plate was obviously slower than that of the fiber board,and the higher the temperature, the greater the difference.Analysis suggests that the nano-sized particles and internal pores are the key factors that lead to low thermal conductivity of nano plates.

关 键 词：热线法 纳米多孔绝热材料 热导率 

分 类 号：O482.22[理学—固体物理]