退火温度对爆炸焊铜/钢复合板界面与组织的影响  

Effect of Annealing Temperature on Interface and Microstructure of Copper/steel Clad Plate by Explosive Welding

作　　者：范祎欣 吴志生[1] 李岩[1] 赵菲[1] 崔超[1] FAN Yixin, WU Zhisheng, LI Yan, ZHAO Fei, CUI Chao(School of Materials Science and Engineering, Taiyuan University of Science and Technology, Taiyuan 030024, Chin)

机构地区：[1]太原科技大学材料科学与工程学院

出　　处：《热加工工艺》2018年第4期134-137,140,共5页Hot Working Technology

摘　　要：通过爆炸焊接法生产铜/钢复合板,并对该复合板进行不同温度的退火处理,以研究不同温度对复合板界面与组织的影响。结果表明：爆炸焊生产的铜/钢复合板界面几乎没有化合物;当退火温度低于700℃时,铜与钢的晶粒都较细小,且结合界面无化合物产生,但当温度高于750℃后,铜的晶粒急剧长大,且产生一定厚度的化合物,对性能是不利的,所以700℃左右为铜/钢复合板合适的退火温度;结合界面显微硬度最大,离界面距离增加,硬度降低;退火处理后的硬度明显降低,且退火温度越高,硬度降低越多。The copper/steel clad plate was produced by explosive welding, and the clad plate was annealed at differenttemperatures to study the effect of different temperatures on the interface and microstructure of the clad plate. The resultsshow that the interface of copper/steel clad plate produced by explosive welding nearly has no compounds. When theannealing temperature is lower than 700 ℃, the grains of copper and steel are relatively small, and the bonding interface doesnot produce compounds. When the temperature is higher than 750 ℃, the copper grain grows rapidly and produces a certainthickness compound, which is detrimental to the performance, so about 700 ℃ is suitable heat treatment temperature forcopper/steel clad plate. The microhardness of the bonding interface is the largest, and the hardness decreases with the increaseof the distance from the interface. After annealing treatment, the hardness decreases obviously, and the higher the annealingtemperature, the more the decrease of the microhardness.

关 键 词：退火温度 铜/钢复合板 界面 组织 

分 类 号：TB333[一般工业技术—材料科学与工程]