基于纯声子辐射模型的超薄绝缘夹层结构  

Thermodynamic Study of Insulating Ultra-Thin Interlayer Construction by Equation of Phonon Radiative Transfer

作　　者：王小贞[1] 张士元[2] 郑百林[3] 贺鹏飞[3] WANG Xiaozhen;ZHANG Shiyuan;ZHENG Bailin;HE Pengfei(College of Physics and Telecommunication Engineering, Fuzhou University, Fuzhou 350116, Fujian, China;Department of Civil Engineering, Fujian University of Technology, Fuzhou 350007, Fujian, China;School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai 200092, China)

机构地区：[1]福州大学物理与信息学院,福建福州350116 [2]福建工程学院土木工程系,福建福州350007 [3]同济大学航空航天与力学学院,上海200092

出　　处：《力学季刊》2018年第1期60-68,共9页Chinese Quarterly of Mechanics

基　　金：福建省自然科学基金(2017J01668)

摘　　要：在复合材料结构中起绝热、增韧作用的绝缘夹层,其加工厚度现在已达到纳米量级,原有的傅立叶热传导定律已无法描述其热能的传递行为,需从分子动力学、量子力学出发,针对不同研究对象建立相应的热传导模型.针对超薄绝缘夹层结构,将纯声子辐射模型和傅立叶热传导模型相结合数值求解热冲击条件下的温度场,并作为热载荷,用于求解结构上表面应力和夹层裂纹驱动力,其结果与只采用傅立叶热传导模型计算的结果相比较,分析了物理参数对温度、应力和裂纹驱动力的影响.结果表明:与只采用傅立叶热传导模型计算的结果相比,按EPRT计算的热传导明显变慢,其表面剥离应力偏大,而夹层裂纹驱动力偏小.同时随着松弛时间增大和声子速度的降低,热传导减缓,表面横向剥离应力增大,超薄绝缘夹层内裂纹尖端驱动力减小.Insulating interlayer that act as thermal insulation and flexibilizer in the composite material were miniaturized in nano scale. Therefore, Fouier heat conduction model can not be used. New heat conduction models need to be constructed in micro/nano scale corresponding to different subjects investigated. For the ultra-thin insulating interlayer, the EPRT（Equation of Phonon Radiative Transfer）（for ultra-thin interlayer） and the Fourier model（for upstate and substrate） were combined to study the temperature field, the thermal peeling stress on the surface, and the driving force of crack by means of numerical method. The results were compared with those from the pure Fourier method（for ultra-thin interlayer, upstate and substrate）. The influences of TBCs heat physical properties（such as, relaxation time and phonon-speed） on the temperature field, the thermal peeling stress and the driving force of crack were analyzed. It is concluded that the temperature gradient and the driving force of crack in the ultra-thin interlayer from the EPRT are lower than those from the Fourier method in the ultra-thin interlayer and substrate. Thermal peeling stress from EPRT is higher than that from the Fourier method at the surface. Furthermore, the temperature gradient and the driving force of crack decrease while the thermal peeling stress increases with the increase of relaxation time and the decrease of phonon-speed.

关 键 词：超薄绝缘夹层结构 纯声子辐射模型 温度场 横向剥离应力 裂纹尖端驱动力 

分 类 号：TQ320[化学工程—合成树脂塑料工业] TN405.94[电子电信—微电子学与固体电子学]