基于振动方式的片式元件翻面装置研究  

Research of a Device for Turning-over Chip Component by Mechanical Vibration

作　　者：付柯楠 石宝松[1] 王玉龙[1] 聂磊[1] FU Kenan;SHI Baosong;WANG Yulong;NIE Lei(Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China)

机构地区：[1]中国科学院长春光学精密机械与物理研究所,吉林长春130033

出　　处：《电子工艺技术》2018年第2期106-108,共3页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:No.61036015)

摘　　要：在SMT组装过程中,针对科研、军工项目印制电路板组装"多品种,小批量"的特点,多采取"手工贴片,回流焊接"的方式。在手工贴片方式下,一些需要向上放置的片式元件通常使用镊子翻面,耗费很大精力,效率低下。制作了一种以振动方式使片式元件翻面的装置,通过多种实验验证了可行性,并将其运用在实际生产中显著提高了效率。Printed circuit board（PCB） soldering in scientific research and military fields is characterized by many varieties and small quantities. So manual pick and place, reflow soldering approach is used in many cases in the process of application of surface mount technology to the field of scientific research and military industry. In the manual process, some chip components that need to be placed face up can only be turned upside down by tweezers. It is laborious and inefficient. A device for turning the chip components in vibration mode is developed, which is verified by many experiments and applied in actual production, which significantly improves the efficiency.

关 键 词：SMT 片式元件 振动 翻面 

分 类 号：TN605[电子电信—电路与系统]