硫酸铜电镀中阳极体系的发展  

Developmental of Anode System on Copper Sulfate Plating

作　　者：关家彬 Guan Jiabin(Engineering Department, Cheon Western （China） Copper Ltd., Foshan 528203, Chin)

机构地区：[1]佛山市承安铜业有限公司工艺部,广东佛山528203

出　　处：《广东化工》2018年第8期151-152,共2页Guangdong Chemical Industry

摘　　要：硫酸铜电镀是重要的化工生产过程,此电镀工艺的阳极分可溶性阳极和不溶性阳极。本文着重介绍了可溶性阳极——磷铜,在中国发展的三十年间通过制造工艺的三次大变革,所带来得质量大提升。同时,也介绍了现时使用不溶性阳极的硫酸铜电镀体系的铜离子补充方式。Copper sulfate plating is a very important chemical production process, The anode system of this plating includes soluble anode and insoluble anode. This paper emphatically describes the development of phosphorous copper anode as a soluble anode in China. The quality of phosphorous copper is improved continuously by the three promotions of manufacturing process over the past 30 years. And this paper introduces the development of supplying copper ion for the insoluble anode system in copper sulfate plating field.

关 键 词：硫酸铜电镀 磷铜 可溶性阳极 不可溶性阳极 

分 类 号：TQ153[化学工程—电化学工业]